Thermal Interface Pad, Hi-Flow 625, 0.5W/m·K, 25 x 19mm 0.127mm, Self-Adhesive [HF625-0.005-AC-104]; 362-9676
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| THÔNG SỐ KỸ THUẬT | |
|---|---|
| Dimensions | 25 x 19mm |
| Thickness | 0.127mm |
| Length | 25mm |
| Width | 19mm |
| Thermal Conductivity | 0.5W/m·K |
| Material | Hi-Flow 625 |
| Self-Adhesive | Yes |
| Minimum Operating Temperature | -30°C |
| Maximum Operating Temperature | +150°C |
| Material Trade Name | Hi-Flow 625 |
| Operating Temperature Range | -30 → +150 °C |