Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive [HF650P-0.001-01-00-122]; 752-4893
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| .THÔNG SỐ KỸ THUẬT: | |
|---|---|
| Thickness | 0.001in |
| Thermal Conductivity | 1.5W/m·K |
| Material | Hi-Flow 650P |
| Self-Adhesive | Yes |
| Minimum Operating Temperature | -40°C |