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MBO 1mm Wire Lead Free Solder, +217°C Melting Point [SN96.5 AG3 CU0.5 10/10 A11 - 500G]; 555-250

THÔNG SỐ KỸ THUẬT Wire Diameter 1mm Model Number SN96.5 AG3 CU0.5 Product Form Wire Melting Point 217°C Percent Silver 0.03 Perce...

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MBO 1mm Wire Lead solder, +183°C Melting Point [SN60 PB 10/10 - 3 CANAUX A11 - 100G]; 547-269

THÔNG SỐ KỸ THUẬT Wire Diameter 1mm Model Number SN60 PB Percent Lead 0.4 Product Form Wire Melting Point 183°C Percent Tin 0.6 ...

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MBO 1mm Wire Lead solder, +183°C Melting Point [SN60 PB 10/10 - 3 CANAUX A11 - 500G]; 547-322

THÔNG SỐ KỸ THUẬT Wire Diameter 1mm Model Number SN60 PB Percent Lead 0.4 Product Form Wire Melting Point 183°C Percent Tin 0.6 ...

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MBO 1mm Wire Lead solder, +183°C Melting Point [SN60 PB CU2 10/10 - 3 CANAUX A11 - 500G]; 547-310

THÔNG SỐ KỸ THUẬT Model Number SN60 PB CU2 Wire Diameter 1mm Percent Lead 0.38 Product Form Wire Melting Point 183°C Percent Tin ...

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MBO 1mm Wire Lead solder, +183°C Melting Point [SN60 PB40 10/10 SANS NETTOYAGE RT15 - 500G]; 547-271

THÔNG SỐ KỸ THUẬT Wire Diameter 1mm Model Number SN60 PB40 Percent Lead 0.4 Product Form Wire Melting Point 183°C Percent Tin 0.6...

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MBO 1mm Wire Lead solder, +183°C Melting Point [SN63 PB 10/10 SANS NETTOYAGE RT15 - 500G]; 547-297

THÔNG SỐ KỸ THUẬT Wire Diameter 1mm Model Number SN63 PB Percent Lead 0.37 Product Form Wire Melting Point 183°C Percent Tin 0.63...

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MBO 1mm Wire Lead solder, +296°C Melting Point [300AG 10/10 CR2 - 500G]; 547-360

THÔNG SỐ KỸ THUẬT Model Number 300AG Wire Diameter 1mm Percent Lead 0.935 Product Form Wire Melting Point 296°C Percent Silver 0....

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MBO 250cm3 Bottle, Peelable Solder Mask [PM21 - FLACON DE 250CC]; 547-348

THÔNG SỐ KỸ THUẬT Peelable Yes Package Size 250cm³ Package Type Bottle

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MBO Granules Lead Free Solder, +217°C Melting Point [GRENAILLE SN99 AG0.3 CU0.7 - POT 500G]; 555-222

THÔNG SỐ KỸ THUẬT Product Form Granules Melting Point 217°C Percent Silver 0.003 Percent Tin 0.99 Product Weight 500g Percent Cop...

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MBO Granules Lead solder, +183°C Melting Point [GRENAILLE SN63 PB37]; 547-350

.THÔNG SỐ KỸ THUẬT: Percent Lead 37% Product Form Granules Melting Point 183°C Percent Tin 63% Flux Type Resin

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MBO Paste Lead Free Solder, +217°C Melting Point [CRÈME SN96.5 AG3 CU0.5 SIRIUS 1 LF - SERINGUE MANU]; 555-193

THÔNG SỐ KỸ THUẬT Product Form Paste Melting Point 217°C Percent Silver 0.03 Percent Tin 0.965 Flux Type Rosin Product Weight 30g...

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