Thermal Interface Pad, Thin Film Polyimide, 0.9W/m·K, 25.4 x 19mm 0.152mm [SPK4-0.006-00-104]; 169-4533
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| THÔNG SỐ KỸ THUẬT | |
|---|---|
| Dimensions | 25.4 x 19mm |
| Thickness | 0.152mm |
| Length | 25.4mm |
| Width | 19mm |
| Thermal Conductivity | 0.9W/m·K |
| Material | Thin Film Polyimide |
| Minimum Operating Temperature | -60°C |
| Maximum Operating Temperature | +180°C |
| Hardness | Shore A 90 |
| Material Trade Name | Sil-Pad K4 |
| Operating Temperature Range | -60 → +180 °C |