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BOYD CORP Heatsink: extruded; grilled; BGA,FPGA; black; L: 37.4mm; W: 37.4mm [10-5607-04G]

Name: BOYD CORP Heatsink: extruded; grilled; BGA,FPGA; black; L: 37.4mm; W: 37.4mm [10-5607-04G]
Brand: BOYD CORP
SKU: 10-5607-04G
Availability: InStock

Mã kho: 10-5607-04G

Mã nhà sản xuất: 10-5607-04G

Tên nhà sản xuất: BOYD CORP

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BOYD CORP Heatsink: extruded; grilled; BGA,FPGA; black; L: 37.4mm; W: 37.4mm [10-5607-04G]

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