Website đang được xây dựng

BOYD CORP Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm [374224B60023G]

Name: BOYD CORP Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm [374224B60023G]
Brand: BOYD CORP
SKU: 374224B60023G
Availability: InStock

Mã kho: 374224B60023G

Mã nhà sản xuất: 374224B60023G

Tên nhà sản xuất: BOYD CORP

0₫ - 0₫

0₫

0₫ - 0₫

0₫

📩 Liên hệ để có giá tốt: CV@chanhvinh.com

Select first item to compare

Select second item to compare

Select third item to compare

Compare

BOYD CORP Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm [374224B60023G]

Added to your cart:

Compare products