ON Semiconductor, FDG6321C [FDG6321C]; 186-8443
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| THÔNG SỐ KỸ THUẬT | |
|---|---|
| Number of Elements per Chip | 2 |
| Mounting Type | Surface Mount |
| Package Type | SC-70 |
| Pin Count | 6 |
| Maximum Power Dissipation | 300 mW |
| Width | 1.35mm |
| Dimensions | 2.2 x 1.35 x 1mm |
| Minimum Operating Temperature | -55 °C |
| Length | 2.2mm |
| Height | 1mm |
| Maximum Operating Temperature | +150 °C |