STMicroelectronics N-Channel MOSFET, 64 A, 650 V, 3-Pin ACEPACK SMIT SH68N65DM6AG [SH68N65DM6AG]; 261-5479

The STMicroelectronics combination of two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. The DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.

Half bridge power module

650 V blocking voltage

Fast recovery body diode

Very low switching energies

Low package inductance