CCICCI02Heat Sink BGA FPGAs Double Sided Adhesive 7.93 °C/W BGA 45 mm 10 mm 45 mm
Heat Sink Material AluminiumNhiệt trở 7.93°C/W
Liên hệ
CCI CCI02. Heat Sink BGA FPGAs Double Sided Adhesive 7.93 °C/W BGA 45 mm 10 mm 45 mm
Features:
- Heat Sink
- BGA
- FPGAs
- Double Sided Adhesive
- 7.93 °C/W
- 45 mm
- 10 mm