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BOYD CORP Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium [374224B00035G]

Name: BOYD CORP Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium [374224B00035G]
Brand: BOYD CORP
SKU: 374224B00035G
Availability: InStock

Mã kho: 374224B00035G

Mã nhà sản xuất: 374224B00035G

Tên nhà sản xuất: BOYD CORP

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BOYD CORP Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium [374224B00035G]

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