CCICCI09Heat Sink BGA FPGAs Double Sided Adhesive 9.96 °C/W BGA 30 mm 6 mm 30 mm
Heat Sink Material AluminiumNhiệt trở 9.96°C/W
Liên hệ
CCI CCI09. Heat Sink BGA FPGAs Double Sided Adhesive 9.96 °C/W BGA 30 mm 6 mm 30 mm
Features:
- Heat Sink
- BGA
- FPGAs
- Double Sided Adhesive
- 9.96 °C/W
- 30 mm
- 6 mm