SOLDER PEAKMS-DIP/SMD1Board: universal

Board variant prototypingCopper plating thickness 18µmHole diameter 1mmLaminate thickness 1mm

Mã nhà sản xuất

MS-DIP/SMD1

Thương hiệu

Mã kho

MS-DIP_SMD1

Liên hệ

Board: universal; single sided,prototyping; W: 60mm; L: 100mm

THÔNG SỐ KỸ THUẬT
Manufacturer	SOLDER PEAK
Manufacturer Part No.	MS-DIP/SMD1
Type of board	universal
Board variant	prototyping, single sided
Material	epoxy resin, fiberglass, FR4
Laminate thickness	1mm
Width	60mm
Length	0.1m
Copper plating thickness	18µm
Hole diameter	1mm
Soldering pads pitch	0.7/2.54mm
Soldering pads configuration	0805, 1206, DIP4, DIP6, DIP8, DIP10, DIP12, DIP14, DIP16, DIP18, DIP20, DIP22, DIP24, DIP28, MELF, SMA, SMB, SMC, SO8, SO10, SO14, SO16, SO18, SO20, SO24, SO28, SOD80, SOD87, SOT23, SOT89, SOT143, SOT223, SOT323
Gross weight	12.14 g

Tài liệu: Product family

Giá: Liên hệ – gửi mã và số lượng về CV@chanhvinh.com để nhận báo giá nhanh.

Added to your cart: