STMICROELECTRONICSSTEVAL-STWINBX1STWIN.box Accelerometer Sensor Evaluation Kit for STEVALSTWINBX1 FP-SNSDATALOG2

STWIN.box - SensorTile Wireless Industrial Node Development Kit

The STWIN.box (STEVAL-STWINBX1) is a development kit and reference design that simplifies prototyping and testing of advanced industrial sensing applications in IoT contexts such as condition monitoring and predictive maintenance.

It is an evolution of the original STWIN kit (STEVAL-STWINKT1B) and features a higher mechanical accuracy in the measurement of vibrations, an improved robustness, an updated BoM to reflect the latest and best-in-class MCU and industrial sensors, and an easy-to-use interface for external add-ons.

The STWIN.box kit consists of an STWIN.box core system, a 480mAh LiPo battery, an adapter for the ST-LINK debugger, a plastic case, an adapter board for DIL 24 sensors and a flexible cable.

The many on-board industrial-grade sensors and the ultra-low power MCU enable applications that feature: ultra-low power, 9 DoF motion sensing, wide-bandwidth vibration analysis, audio and ultrasound acoustic inspection, very precise local temperature, and environmental monitoring.

A rich set of software packages is available in source code. Optimized firmware libraries and a complete companion cloud application help to speed up the design cycle to develop end-to-end solutions.

The kit supports a broad range of connectivity options, including the built-in RS485 transceiver, BLE, Wi-Fi, and NFC.

The STWIN.box also includes a 34-pin expansion connector for small form factor daughter boards associated with the STM32 family, such as the STEVAL-C34KAT1 vibrometer and temperature sensors expansion board.

The STWIN.box is suitable for field trials, demonstrations, and PoC for industrial IoT applications that use ST software and third-party software.

Key features

• Multisensing wireless platform for vibration monitoring and ultrasound detection
• Built around STWIN.box core system board with processing, sensing, connectivity, and expansion capabilities
• Ultra-low power Arm® Cortex®-M33 with FPU and TrustZone at 160 MHz, 2048 kBytes Flash memory (STM32U585AI)
• MicroSD card slot for standalone data logging applications
• On-board Bluetooth® low energy v5.0 wireless technology (BlueNRG-M2), Wi-Fi (EMW3080) and NFC (ST25DV04K)
• Option to implement authentication and brand protection secure solution with STSAFE-A110
• Wide range of industrial IoT sensors:

Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)

3D accelerometer + 3D gyro iNEMO inertial measurement unit (ISM330DHCX) with Machine Learning Core

High-performance ultra-low-power 3-axis accelerometer for industrial applications (IIS2DLPC)

Ultra-low power 3-axis magnetometer (IIS2MDC)

High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with Embedded Machine Learning Core (IIS2ICLX)

Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in full-mold package (ILPS22QS)

Low-voltage, ultra low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature sensor (STTS22H)

Industrial grade digital MEMS microphone (IMP34DT05)

Analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU)

• Expandable via a 34-pin FPC connector