VISHAYCRCW0402301RFKEDResistor: thick film
0402 Format CRCW Series - 1% (Paper T/R) (10Ω to 9.76kΩ) From Vishay, the CRCW series consists of surface mount thick film resistors. These SMD resistors are constructed from a high quality ceramic with a metal glaze. With pure tin plated solder contacts, you can use soldering processes that either contain lead or are lead-free. Features and benefits: Metal glaze on high quality ceramic Protective over glaze Excellent stability (ΔR/R ≤ 1 % for 1000h at 70 °C) Lead (Pb)-free solder contacts on Ni barrier layer Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes Applications: These SMD resistors are suited to a wide range of applications include telecommunication equipment, cameras and computers. With an AEC-Q200 qualification, these SMD resistors are also suitable for automotive applications. Standard Thick Film Chip Resistors Stability ΔR/R = 1 % for 1000 h at 70 ° C Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes Metal glaze on high quality ceramic
0402 Format CRCW Series - 1% (Paper T/R) (10Ω to 9.76kΩ)
From Vishay, the CRCW series consists of surface mount thick film resistors. These SMD resistors are constructed from a high quality ceramic with a metal glaze. With pure tin plated solder contacts, you can use soldering processes that either contain lead or are lead-free.
Features and benefits:
Metal glaze on high quality ceramic
Protective over glaze
Excellent stability (ΔR/R ≤ 1 % for 1000h at 70 °C)
Lead (Pb)-free solder contacts on Ni barrier layer
Pure tin plating provides compatibility with lead (Pb)-free and lead containing soldering processes
Applications:
These SMD resistors are suited to a wide range of applications include telecommunication equipment, cameras and computers.
With an AEC-Q200 qualification, these SMD resistors are also suitable for automotive applications.
Standard Thick Film Chip Resistors
Stability ΔR/R = 1 % for 1000 h at 70 ° C
Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free and lead containing soldering processes
Metal glaze on high quality ceramic













